PREDICTION AND COMPARISON OF SIZE OF THE COPPER AND ALUMINIUM BUS DUCT SYSTEM BASED ON AMPACITY AND TEMPERATURE VARIATIONS USING MATLAB

Main Article Content

Thirumurugaveerakumar S Sakthivel M Sharmila Deve V

Abstract

The main objective of this paper is to propose an algorithm to predict and compare the sizes of the bus bar with materials like copper and aluminium by considering the allowable ampacity and allowable temperature rise with natural and forced convection cooling arrangement. Theoretical analysis is carried out with modified size of the copper busbar using MATLAB, to analyze the ampacity and temperature variation under the natural and  forced convection mode. The algebraic equation developed from thermal model is solved using MATLAB for the determination of the allowable temperature rise and ampacity of rectangular-section bus bars of copper  and aluminium and also for different sizes of busbar. An algorithm has been developed for the analysis. Experimental observations of temperature variation in copper busbar with standard size under natural and forced cooling mode are validated with the algebraic equation developed from thermal model is solved using MATLAB. It is concluded that busbar dimensions are compared for the materials Copper and Aluminium to  predict the suitable equivalent dimensions for the same ampacity level and within the allowable temperature rise to reduce the cost of panel.

Article Details

How to Cite
S, Thirumurugaveerakumar; M, Sakthivel; V, Sharmila Deve. PREDICTION AND COMPARISON OF SIZE OF THE COPPER AND ALUMINIUM BUS DUCT SYSTEM BASED ON AMPACITY AND TEMPERATURE VARIATIONS USING MATLAB. Thermal Science, [S.l.], mar. 2017. ISSN 2334-7163. Available at: <http://thermal-science.tech/journal/index.php/thsci/article/view/2316>. Date accessed: 20 feb. 2018. doi: https://doi.org/10.2298/TSCI160407153T.
Section
Articles
Received 2017-03-08
Accepted 2017-03-14
Published 2017-03-14

References

[1] Ho, S.L., Li Y., Lin, X., Edward Lo, W.C., Yang, S.Y., Cheng, K.W.E., Wong, K.F., Calculations of Eddy Current, Fluid and Thermal Fields in an Air Insulated Bus Duct System, IEEE Trans. on Magnetics., 39 (2006), 1, pp.101.
[2] Ho, S. L., Li, Y., Lin, X., Wong, H. C., Cheng, K. W. E., A 3-D Study of Eddy Current Field and Temperature Rises in a Compact Bus Duct System, IEEE Trans. on Magnetics., 42 (2006), 4, pp. 987-990.
[3] Ho, S. L., Li, Y., Lin, X., Edward Lo, W. C., Cheng, K. W. E., Calculations of Eddy Current, Fluid, and Thermal Fields in an Air Insulated Bus Duct System, IEEE Trans. on Magnetics., 43(2007), 4, pp.1433-1436.
[4] Labridis, D.P., Dokopolos, P.S., Electromagnetic forces in three-phase rigid busbars with rectangular cross section, IEEE Trans. on Magnetics., 11(1996), 2, pp.793-800.
[5] Thirumurugaveerakumar, S., Sakthivel, M., Valarmathi, S., Experimental and Analytical Study on the Bus Duct System for the Prediction of Temperature Variations Due To the Fluctuation of Load, Journal of Electrical Engineering and Technology., 9(2014), 6, pp.2036-2041.
[6] Thirumurugaveerakumar, S., Sakthivel, M., Rajendran, S., Experimental and Analytical Study of Effect of Forced Convectional Cooling of Bus Duct System in the Prediction of Temperature Rise, International Journal of Advances in Engineering and Research.,10(2015), 21, pp.42202-42208.
[7] Robert Coneybeer, T., Black, W.Z., Bush, R.A., Steady-state and Transient Ampacity of Bus bar, IEEE Trans. Power Delivery., 9(1994), 4, pp.1822-1829.
[8] Klimenta, D. O., Perović, B. D., Jevtić, M. D., Radosavljević, J. N., An analytical algorithm to determine allowable ampacities of horizontally installed rectangular bus bars, Thermal Science 20 (2016), 2, pp. 717-730.
[9] Kim, J. K., Hahn, S. C., Park, K. Y., Kim, H. K., Oh, Y. H., Temperature rise prediction of EHV GIS bus bar by coupled magneto-thermal finite element method, IEEE Trans. on Magnetics 41(2005), 5, pp. 1636-1639.
[10] Bottauscio, O., Carpaneto, E., Chiampi, M., Chiarabaglio, D., Panaitescu, I., Numerical and experimental evaluation of magnetic field generated by power bus bar systems, IEEE Transactions on Proc. Gener, Transm, Distrib., 143(1996), 5, pp. 455-460.